XCVM1402-1LSINSVF1369

Architecture: — MPU, FPGA

Core Processor: — Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

Flash Size: — -

RAM Size: — -

Peripherals: — DDR, DMA, PCIe

Connectivity: — CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed: — 400MHz, 1GHz

Primary Attributes: — Versal™ Prime FPGA, 1.2M Logic Cells

Operating Temperature: — -40°C ~ 100°C (TJ)

Package / Case: — 1369-BFBGA, FCBGA

Supplier Device Package: — 1369-FCBGA (35x35)